LED Package Technology Commonly Used In 40 Kinds Of Chips (Part 4)

- Apr 08, 2019-

31, MQFP package (metricquadflatpackage)


A classification of QFPs in accordance with JEDEC (United States Joint Electronic Equipment Council) standards. Refers to a standard QFP with a lead center distance of 0.65mm and a body thickness of 3.8mm to 2.0mm.


32, MQIB package (metalquad)


A QFP package developed by Olin Corporation of the United States. Both the substrate and the cover are made of aluminum and sealed with an adhesive. The power of 2.5W to 2.8W can be tolerated under natural air cooling conditions. Japan Shinko Electric Industrial Co., Ltd. was licensed to start production in 1993.


33, MSP package (minisquarepackage)


The nickname of QFI (see QFI) is often referred to as MSP in the early stages of development. QFI is the name given by the Japan Electromechanical Industry Association.


34, OPMAC package (overmoldedpadarraycarrier)


Molded resin seals the bump display carrier. The name used by Motorola in the United States for molded resin sealed BGA.


35, P- (plastic) package


Indicates the mark of the plastic package. For example, PDIP stands for plastic DIP.


36, PAC package (padarraycarrier)


Bump display carrier, another name for BGA.


37, PCLP (printedcircuitboardleadlesspackage)


Printed circuit boards are leadless packaged. The name adopted by Fujitsu of Japan for plastic QFN (plastic LCC) (see QFN). The center distance of the pins is 0.55mm and 0.4mm. Currently in the development stage.


38, PFPF (plasticflatpackage)


Plastic flat package. Another name for plastic QFP (see QFP). The name adopted by some LSI manufacturers.


39, PGA (pingridarray)


Display pin package. One of the cartridge type packages has vertical pins on the bottom surface arranged in a display. The package substrate basically uses a multilayer ceramic substrate. In the case where the material name is not specifically indicated, most of them are ceramic PGAs for high-speed large-scale logic LSI circuits. higher cost. The lead center distance is usually 2.54mm and the number of pins is from 64 to 447. In order to reduce the cost, the package substrate can be replaced with a glass epoxy printed substrate. There are also 64 to 256-pin plastic PGAs. In addition, there is a short lead surface mount PGA (PGA) with a 1.27mm lead pitch.


40, PiggyBack


Load package. A ceramic package with a socket, similar to DIP, QFP, QFN. Used to evaluate program validation operations when developing devices with microcomputers. For example, plug the EPROM into the socket for debugging. This kind of package is basically a fixed product, which is not very circulated on the market.