LED Package Technology Commonly Used In 40 Kinds Of Chips (Part 3)

- Apr 08, 2019-

21, H-(withheatsink)

Indicates a mark with a heat sink. For example, HSOP stands for SOP with a heat sink.

22, PinGridArray (SurfaceMountType)

Surface mount type PGA. Usually the PGA is a cartridge type package with a lead length of about 3.4 mm. The surface mount PGA has a display-like pin on the underside of the package, ranging in length from 1.5mm to 2.0mm. Mounting uses a method of soldering to a printed substrate, and is therefore also referred to as a bumper PGA. Because the pin center distance is only 1.27mm, which is less than half of the plug-in type PGA, the package body can be made not very large, and the pin count is more than the plug-in type (250-528), which is a package for large-scale logic LSI. . The packaged substrate has a multilayer ceramic substrate and a glass epoxy printing base. Packaging with a multilayer ceramic substrate has been put to practical use.

23, JLCC package (J-leadedchipcarrier)

J-shaped pin chip carrier. Refers to the window CLCC and the ceramic QFJ with window (see CLCC and QFJ). The name adopted by some semiconductor manufacturers.

24, LCC package (Leadlesschipcarrier)

Leadless chip carrier. Refers to the surface mount package with no electrodes on the four sides of the ceramic substrate. It is a package for high speed and high frequency ICs, also known as ceramic QFN or QFN-C (see QFN).

25, LGA package (landgridarray)

Contact display package. That is, a package having an array state electrode contact is fabricated on the bottom surface. Plug in the socket when assembling. Practically available, ceramic LGAs with 227 contacts (1.27mm center-to-center) and 447 contacts (2.54mm center-to-center) are used in high-speed logic LSI circuits.

Compared to QFP, LGA can accommodate more I/O pins in a smaller package. In addition, since the impedance of the lead is small, it is suitable for a high-speed LSI. However, due to the complicated manufacturing of the socket and the high cost, it is basically not used very much now. It is expected that its demand will increase in the future.

26, LOC package (leadonchip)

On-chip lead package. One of the LSI packaging technologies, the front end of the lead frame is a structure above the chip, and a bump is formed near the center of the chip, and is electrically connected by wire stitching. The chip accommodated in the same size package has a width of about 1 mm compared to the structure in which the lead frame is originally disposed near the side of the chip.

27, LQFP package (lowprofilequadflatpackage)

Thin QFP. Refers to the QFP with a package body thickness of 1.4mm, which is the name used by the Japan Electromechanical Industry Association according to the new QFP form factor.

28, L-QUAD package

One of the ceramic QFP. The package substrate is made of aluminum nitride, and the base thermal conductivity is 7 to 8 times higher than that of alumina, and has good heat dissipation properties. The packaged frame is made of alumina, and the chip is sealed by potting, thereby suppressing cost. It is a package developed for logic LSI that can tolerate W3 power under natural air cooling conditions. 208-pin (0.5mm center-to-center) and 160-pin (0.65mm center-to-center) LSI logic packages have been developed and started mass production in October 1993.

29, MCM package (multi-chipmodule)

Multi-chip components. A package in which a plurality of semiconductor bare chips are assembled on a wiring substrate.

According to the substrate material, it can be divided into three categories: MCM-L, MCM-C and MCM-D.

MCM-L is an assembly using a conventional glass epoxy multilayer printed substrate. The wiring density is not so high and the cost is low.

MCM-C is a component in which a multilayer wiring is formed by a thick film technique, and a ceramic (alumina or glass ceramic) is used as a substrate, similar to a thick film hybrid IC using a multilayer ceramic substrate. There is no significant difference between the two. The wiring density is higher than MCM-L.

MCM-D is a component in which a multilayer wiring is formed by a thin film technique, and ceramic (aluminum oxide or aluminum nitride) or Si or Al is used as a substrate. The wiring scheme is the highest among the three components, but the cost is also high.

30, MFP package (miniflatpackage)

Small flat package. Another name for plastic SOP or SSOP (see SOP and SSOP). The name adopted by some semiconductor manufacturers.